Automatic Wafer Unloader ZP-IV & LSP-IV

Equipment Model: DP-IV/LXP-IV

Equipment Application

ZP-IV
Load the stacked wafers into the cassette and transport the cassette to the next process step automatically.

LSP-IV：
Load the wafers in the cassette to the 5-lane/8-lane/10-lane inline cleaning equipment automatically.

Feature

ZP-IV

• With PLC control and the loading process is completed automatically; touch-screen operation, which is easy and clear.
• With double workstations improve the working efficiency.
• With overlapping detection, loading station with/ without wafer detection, cassette positioning and monitoring function, etc.
• Inline/Offline optional.
• Compatible with AGV, RFID, MES function.

LSP-IV

With PLC control the loading process is completed automatically, touch-screen operation, which is easy and clear.

With single lane loading/unloading method which guarantees the loading/unloading productivity and meets the requirement of the wafer production according to batches as well.

Double workstation, exchanging magazine/cassette no need to interrupt equipment operation.

Wafer breakage detection and broken wafer treatment before transferring to the unloader (need extra charges, standard equipment without this configuration).

Compatible with AGV, RFID, MES function.

Parameters