Automatic Wafer Unloader

Equipment Application

• DP-IV: This unit is designed to transfer wafers from the cassette of the previous process to the cassette of the next process.
• LXP-IV: Specifically built for unloading wafers from 5/8/10-lane inline cleaning equipment to cassettes.

Features:

DP-IV:

1. PLC Control: The unloading process is fully automated and controlled by a Programmable Logic Controller (PLC), ensuring precision and reliability.
2. User-Friendly Interface: Equipped with a touch-screen interface, operation is intuitive and straightforward, facilitating ease of use.
3. Single Lane Loading/Unloading: Utilizes a single lane loading/unloading method, optimizing productivity and meeting batch production requirements efficiently.
4. Double Workstation: Features dual workstations, allowing magazine/cassette exchange without interrupting equipment operation, thereby enhancing workflow continuity.
5. Inline/Offline Option: Offers the flexibility of both inline and offline operation, catering to diverse production setups and needs.
6. Compatibility: Optional compatibility with AGV (Automated Guided Vehicle), RFID (Radio-Frequency Identification), and MES (Manufacturing Execution System) functions, providing integration versatility.

LXP-IV:

1. Automated Unloading: Similar to the DP-IV, the unloading process is fully automated, ensuring efficiency and accuracy.
2. Advanced Functions: Incorporates advanced features such as breakage detection and treatment before unloading, enhancing wafer handling and minimizing damage.
3. Additional Functions (Optional): Optional functionalities include wafer turnover and weight testing, providing further customization and optimization options.
4. Compatibility: Like the DP-IV, it is compatible with AGV, RFID, and MES management functions, enabling seamless integration and enhanced control.

Parameters

Benefits:

1. Increased Efficiency: Automatic wafer unloading eliminates the need for manual intervention, streamlining the production process and maximizing operational efficiency.
2. Enhanced Precision: PLC control ensures accurate and consistent unloading, minimizing errors and improving overall quality.
3. User-Friendly Operation: Intuitive touch-screen interfaces make operation easy and clear, reducing the learning curve for operators and enhancing productivity.
4. Flexible Configurations: Both models offer options for single lane loading/unloading and inline/offline operation, providing flexibility to adapt to different production setups and requirements.
5. Improved Workflow Continuity: Dual workstations allow for magazine/cassette exchange without interrupting equipment operation, ensuring seamless workflow continuity and minimizing downtime.
6. Reduced Breakage: Breakage detection and treatment features (available in select models) help identify and address damaged wafers before unloading, reducing waste and minimizing production losses.
7. Customization Options: Optional functionalities such as wafer turnover and weight testing (available in select models) provide customization options to meet specific production needs and optimize performance.
8. Compatibility: Compatibility with AGV, RFID, and MES management functions facilitates seamless integration with existing systems, enhancing control and monitoring capabilities.
9. High Throughput: With maximum throughput of up to 10,000 pieces per hour, these automatic wafer unloaders offer high-speed operation, ensuring efficient production output.
10. Reliable Performance: Designed with robust components and extensive electronic protection, these systems deliver reliable performance even in demanding manufacturing environments.