Inline Acid Polishing Equipment
Equipment Application Equipment Application
Etching/polishing, cleaning and drying of single and polycrystalline silicon wafers.
Etching/polishing, cleaning and drying of mono/multi crystalline solar cells.
Front protection→Etching/Polishing→Alkaline cleaning→Pickling
→DryingWater layer protection→Etching/Polishing→Alkaline cleaning→Acid Cleaning→DryingTechnical
1. High capacity: 5 lanes, 4500pcs/hour, 10 lanes, 8000pcs/hour.
High Through put: 5-lane 4500pcs/h; 10-lane 8000pcs/h.
2. High uniformity and long liquid life.
Excellent uniformity, long bath life time.
3. Support multiple additive or mixed additive technologies.
Various additives or mixed additives technology.
4. Support the thinnest 120μm silicon wafer.
Wafer thickness handling capability up to 120μm.
5. Quickly change the liquid, change the liquid online.
Quick inline bath change.
6. Support backside polishing process, ultra-low drug consumption.
Suitable for rear side polishing and with low chemical consumption.
7. Support MES, optional online weighing detection.
Suitable with MES ; Inline weight testing is optional.
8. Compatible with acid polishing function.
Compatible with acid polish function.