Automatic Wafer Handling System for DOA Equipment

Equipment Usage

The Automatic Wafer Handling System for DOA Equipment facilitates integrated wafer loading and unloading processes. It efficiently unloads wafers from the quartz boat to the cassette or loads wafers from the cassette to the quartz boat. It supports various configurations, including single-side or double-side diffusion setups, and ensures continuous production with its seamless loading and unloading capabilities.

Features:

1. High Reliability: Equipped with an imported six-axis lift for loading/unloading, ensuring precise and reliable placement of wafers. The system utilizes IPC-based master computer software for high-speed data interaction via network communication.
2. Positioning Precision: Utilizes precise detection components to detect the dynamic position of the quartz boat, ensuring accurate positioning during the unloading process.
3. Temperature Control: Incorporates a cooling system before unloading to prevent any adverse effects on the wafers and equipment due to high temperature, ensuring product quality and equipment longevity.
4. Specialized Gripper Technology: Implements special processing technology for the comb and gripper, reducing the marks on wafers and enhancing product quality.
5. Flexible Cassette Orientation: Offers the flexibility to choose between vertical or horizontal cassette orientation based on customer requirements, allowing for optimal space utilization and customization.
6. Optional Functions: Provides optional MES function, sheet resistance detection, and AGV integration, offering enhanced functionality and customization according to specific production needs.

Parameters

The Automatic Wafer Handling System for DOA Equipment combines advanced technology with customizable features, offering efficient and reliable handling of wafers in semiconductor manufacturing processes.

Benefits:

1. Enhanced Efficiency: The Automatic Wafer Handling System streamlines the loading and unloading processes, reducing manual intervention and increasing overall operational efficiency. With high-speed data interaction and precise positioning, it optimizes workflow and minimizes downtime.
2. Improved Reliability: Equipped with advanced technology such as PLC control and imported six-axis lifts, the system ensures reliable performance and precise handling of wafers. This reliability translates to consistent product quality and reduced risk of errors or equipment malfunctions.
3. Product Quality Assurance: Specialized gripper technology and temperature control features mitigate the risk of damage to wafers during handling. By reducing marks on wafers and controlling temperature, the system maintains product integrity and enhances quality assurance.
4. Flexibility and Customization: The system offers flexibility in cassette orientation and optional functions such as MES integration and AGV compatibility. This allows for customization according to specific production requirements and enhances adaptability to evolving manufacturing needs.
5. Optimized Space Utilization: With the option to choose between vertical or horizontal cassette orientation, the system maximizes space utilization within the production environment. This flexibility ensures efficient use of available space and facilitates layout optimization.
6. Cost Savings: By automating loading and unloading processes and minimizing the risk of product damage, the system reduces labor costs and material waste. Additionally, its modular design and compatibility with optional functions offer scalability, allowing for cost-effective expansion or customization as needed.
7. Enhanced Data Monitoring and Management: Integration with MES functions and optional features such as real-time data monitoring and RFID compatibility enable comprehensive data management and analysis. This facilitates process optimization, decision-making, and traceability, contributing to overall operational excellence.