Equipment Name
Automatic Wafer Handling System for DOA Equipment
Equipment Model
SYZ-VI-B
Equipment Application
The wafer assembly and unloading are integrated, and the diffused silicon wafers can be unloaded from the quartz boat into the wafer basket, and the textured silicon wafers can also be loaded into the quartz boat from the wafer basket. Two pieces can be inserted into one quartz boat slot to realize single-sided diffuser technology, or one piece can be inserted into one quartz boat slot to achieve double-sided diffuser technology. The continuous connection method of loading and unloading is adopted to realize continuous production; it can also be loaded or unloaded separately.
Integrated wafer loading& unloading, unloading the wafers from the quartz boat to the cassette or loading the wafers from the cassette to the quartz boat. Available for double back-to-back wafers in one slot which realize single side diffusion or available for single wafer in a slot for double-side diffusion. With continuous wafer loading&unloading can guarantee the continuous production . Or be used only for wafer loading or unloading is also available.
Technical Features
1. Imported six-axis manipulators are used to load and unload wafers to ensure high reliability of silicon wafers.
With imported six-axis lift to load/unload and ensures high reliability of picking and placing of wafers.
2. HMI adopts (IPC) industrial computer to run upper software, and realizes high-speed data interaction through network communication.
With IPC based running master computer software in HMI, high speed data interaction can be realized by network communication.
3. Use precise detection components to detect the dynamic position of the quartz boat to achieve corrective positioning.
With precise detection components to dectect the dynamic position of the quartz boat to rectifying the positioning.
4. There is a cooling system before unloading, which can prevent the adverse effects on silicon wafers and equipment due to high temperature.
With cooling system before the unloading process, which can avoid any harmful effect on the wafers and equipment caused by high temperature.
5. The important parts of top teeth and suction cups adopt special processing technology, which greatly reduces the marks of top teeth and suction cups.
The comb, gripper adopts special processing technology which greatly reduces the marks on wafers.
6. The loading and unloading flower baskets can be vertical or horizontal, and customers can choose flexibly according to their needs.
Cassette can be vertical or horizontal, customers can choose flexibly according to their needs.
7. Optional MES function; optional formula resistance detection module; optional AGV.
MES function, sheet resistance detection and AGV, optional.
Device Parameters
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