Fully Automatic FOB Bonding Machine

The CYFB850B is a mid-size fully automatic FOB bonding machine designed to revolutionize the NB/⻋load display assembly process. This advanced machine offers high-precision FOB bonding with ACF attached to a single PCB on one side of 7-17.3 inch displays, connected to an FPC on the LCM.

Key Features:

• Fully Automatic FOB Bonding: Achieve fully automatic FOB bonding with precision and efficiency, streamlining the assembly process for NB/⻋load displays.
• ACF Attachment Configuration: The machine is equipped with 2 groups of ACF attachment, 1 group of alignment, and 2 groups of local pressure mode (2+1+2 mode), ensuring accurate and secure bonding.
• High-Precision Bonding: ACF stickers adopt the Short-Bar method, while FOB native pressure adopts the Pitch-Bar mode, ensuring high precision and reliability in bonding.
• Automatic PCB Tray Loading: The equipment features automatic PCB tray loading, simplifying the setup process and improving efficiency.
• Unmanned Operation: With tray automatic feeding and CV or platform feeding/unloading, the machine can achieve fully automatic unmanned operation, enhancing productivity and reducing labor costs.
• CIM Communication System Compatibility: Can be equipped with CIM communication system and code reading equipment for easy data acquisition and management, improving overall efficiency and traceability.

Upgrade your assembly process with the CYFB850B Fully Automatic FOB Bonding Machine. Experience precision, efficiency, and reliability in FOB bonding for NB/⻋load displays, revolutionizing your manufacturing operations.