Trough Alkali Polishing Cleaning Equipment

Equipment Application:

This cutting-edge equipment is meticulously designed for the precise polishing, etching, and cleaning of silicon wafers following the diffusion process. Its versatility extends to facilitating backside texturing and cleaning of double-sided cells, ensuring optimal performance in solar cell manufacturing processes.

Process Flow:

• Pre-cleaning
• Polishing
• Post-cleaning or O3 cleaning
• Pickling
• Pre-dehydration
• Drying (for reference)

Technical Features:

1. Capacity: With a capacity of 400 pieces per batch and an impressive throughput of 8000 pieces per hour, it ensures high efficiency and productivity.
2. Versatility: The equipment is adept at accommodating backside etching and polishing, along with single-crystal backside texturing processes, catering to diverse manufacturing needs.
3. Adaptability: It supports a range of additive technologies, offering flexibility in the manufacturing process to meet specific requirements.
4. Handling Capability: The equipment can handle silicon wafers with a thickness as thin as 120μm, enabling precision manufacturing even with delicate materials.
5. Cleanliness: Featuring a dry clean area and a self-cleaning system, it maintains optimal cleanliness standards, crucial for ensuring product quality.
6. Fluid Management: Its quick fluid change and online fluid change capabilities streamline operations, minimizing downtime and maximizing efficiency.
7. Integration: It seamlessly integrates with Manufacturing Execution Systems (MES), Radio-frequency identification (RFID) systems, and offers an optional online weighing function, providing comprehensive control and monitoring capabilities throughout the manufacturing process.

Benefits of Trough Alkali Polishing Cleaning Equipment

1. Enhanced Productivity: With a high throughput of 8000 pieces per hour, the equipment significantly boosts manufacturing efficiency, allowing for larger production volumes within shorter time frames.
2. Improved Quality: The precise polishing, etching, and cleaning processes ensure consistent and uniform results, leading to higher quality silicon wafers and solar cells with reduced defects.
3. Versatility: Its compatibility with various additive technologies and processes such as backside etching and texturing enables manufacturers to adapt to evolving industry standards and customer demands easily.
4. Cost Efficiency: The equipment’s efficient fluid management system and quick fluid change capabilities minimize wastage and reduce operational costs associated with consumables, contributing to overall cost savings.
5. Increased Yield: By handling silicon wafers as thin as 120μm with precision, the equipment minimizes material wastage and enhances yield rates, maximizing the return on investment for manufacturers.
6. Streamlined Operations: Integration with MES and RFID systems streamlines workflow management and data tracking, facilitating better decision-making, and process optimization.
7. Reduced Downtime: The equipment’s self-cleaning system and online fluid change capabilities minimize maintenance downtime, ensuring continuous operation and maximizing uptime for production.