Trough Alkali Polishing Cleaning Equipment

Equipment Name

Batch Alkaline Polishing Equipment

Equipment Model Equipment Model

SC-CSZ8000E-14F

Equipment Application Equipment Application

It is used for polishing, etching and cleaning of silicon wafers after diffusion, as well as for backside texturing and cleaning of double-sided cells.
This equipment is used for polishing, etching and cleaning treatment of diffused wafers and also compatible for texturing and cleaning treatment of bifacial solar cells.

Process Flow

Pre-cleaning →polishing →post-cleaning or O3 cleaning →pickling →pre-dehydration →drying (for reference) .
Pre-cleaning→Polishing→Post-cleaning/ O3 cleaning→Acid cleaning→Hot water drying→Drying (for reference only)

Technical Features Features

1. Capacity: 400 pieces/batch, 8000 pieces/hour.
Throughput: 400pcs/batch, 8000pcs/h.

2. Compatible with backside etching and polishing and single crystal backside texturing process.
Compatible with rear side etch polishing and mono-crystalline rear side texturing process.

3. Support a variety of additive technologies.
Suitable for various additives.

4. Support the thinnest 120um silicon wafer.
Wafer thickne ss handling capability up to 120μm.

5. Dry clean area, self-cleaning system.
With dry clean area and self-cleaning system.

6. Quick fluid change, online fluid change.
Quick inline bath change.

7. Support MES, RFID and optional online weighing function.
Suitable with MES, RFID system, inline weight testing optional.

Device parameters Parameters